Acta Materialia Turcica

Yazarlar: ["Wasiu AYOOLA", "Stephen DUROWAYE", "Muyideen BODUDE", "Tosin ORİMOYEGUN", "Ola AJAYİ", "Olujide OYERİNDE"]

Konular:-

Anahtar Kelimeler:Graphite,Silicon Carbide,Copper Alloy,Mould Casting,Hybrid Composites

Özet: Effects of graphite (C) and silicon carbide particulates (SiCp) on the morphology, electrical and mechanical properties of C10200 copper (Cu) alloy have been investigated. The Cu alloy was reinforced with blended C and SiCp in varied wt. % by mould casting method to produce Cu-SiCp/C composites. Mechanical, electrical and microstructural properties of the hybrid Cu-SiCp/C composites were investigated. The developed composites exhibited acceptable electrical conductivity despite the addition of SiC/C particulates. The electrical conductivity of the Cu-SiCp/C composites is within the bound limits required in literature. The hybrid composite with 30/50/20 % formulation of Cu/SiCp/C exhibited the highest ultimate tensile strength of 90 N/mm2 and 92 N/mm2 for the 212 µm and 710 µm particle sizes respectively. The composite with 30/50/20 % formulation of Cu/SiCp/C exhibited hardness values of 28.7 HB and 30 HB for the 212 µm and 710 µm particle sizes respectively. The addition of SiCp/C appreciably increased the tensile strength and hardness of the composites.

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