Current Proceedings on Technology

Current Proceedings on Technology

The efficiency of using a thermoelectric module on CPU systems in the perspective of cooling

Yazarlar: Serhat Orkun Tan, Huseyin Demirel, Ilker Turker

Cilt 1 , Sayı - , 2012 , Sayfalar -

Konular:-

Anahtar Kelimeler:Thermoelectric module,CPU,Cooling Systems  

Özet:   The evolving software and internet technology forces the processors of computers to process data faster than ever. This hardworking character of the recent processors implies the temperature fact to be handled well in order to avoid the malfunction and failure of the CPU. For this reason an effective cooling mechanism should be installed to the processors. For pointing out the most efficient mechanism, the methods such as heat sink, water cooling, heat pipe and thermoelectric module are experimentally observed and as a result of these experiments thermoelectric cooler method in addition to water cooling system is stated out as the best method due to the stability of temperature. This observation is based on a computer having a combined cooling system of thermoelectric module and water cooler, with a CPU forced to run at full performance. The stability of the temperature was tracked via a hardware monitoring software. Depending on the tracked values this article implies that, in comprehensive systems thermoelectric module additional with water cooling system is a more effective system for the CPU in the perspective of cooling.


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BibTex
KOPYALA
@article{2012, title={The efficiency of using a thermoelectric module on CPU systems in the perspective of cooling}, volume={1}, number={0}, publisher={Current Proceedings on Technology }, author={Serhat Orkun Tan, Huseyin Demirel, Ilker Turker}, year={2012} }
APA
KOPYALA
Serhat Orkun Tan, Huseyin Demirel, Ilker Turker. (2012). The efficiency of using a thermoelectric module on CPU systems in the perspective of cooling (Vol. 1). Vol. 1. Current Proceedings on Technology .
MLA
KOPYALA
Serhat Orkun Tan, Huseyin Demirel, Ilker Turker. The Efficiency of Using a Thermoelectric Module on CPU Systems in the Perspective of Cooling. no. 0, Current Proceedings on Technology , 2012.