Isı Bilimi ve Tekniği Dergisi
FSI Analysis of Wire Sweep in Encapsulation Process of Plastic Ball Grid Array Packaging
Yazarlar: D. RAMDAN, C.Y. KHOR, M. ABDUL MUJEEBU, M.Z. ABDULLAH, W.K. LOH , C.K. OOI
Cilt 33 , Sayı 1 , 2013 , Sayfalar 101-109
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BibTex
KOPYALA
@article{2013, title={FSI Analysis of Wire Sweep in Encapsulation Process of Plastic Ball Grid Array Packaging}, volume={33}, number={101–109}, publisher={Isı Bilimi ve Tekniği Dergisi}, author={D. RAMDAN, C.Y. KHOR, M. ABDUL MUJEEBU, M.Z. ABDULLAH, W.K. LOH , C.K. OOI}, year={2013} }
APA
KOPYALA
D. RAMDAN, C.Y. KHOR, M. ABDUL MUJEEBU, M.Z. ABDULLAH, W.K. LOH , C.K. OOI. (2013). FSI Analysis of Wire Sweep in Encapsulation Process of Plastic Ball Grid Array Packaging (Vol. 33). Vol. 33. Isı Bilimi ve Tekniği Dergisi.
MLA
KOPYALA
D. RAMDAN, C.Y. KHOR, M. ABDUL MUJEEBU, M.Z. ABDULLAH, W.K. LOH , C.K. OOI. FSI Analysis of Wire Sweep in Encapsulation Process of Plastic Ball Grid Array Packaging. no. 101–109, Isı Bilimi ve Tekniği Dergisi, 2013.