Isı Bilimi ve Tekniği Dergisi
FSI Study of the Effect of Air Inlet/Outlet Arrangements on the Reliability and Cooling Performances of Flexible Printed Circuit Board Electronics
Yazarlar: W.C. LEONG, M.Z. ABDULLAH, C.Y. KHOR, H.J. TONY TAN
Cilt 33 , Sayı 1 , 2013 , Sayfalar 43-53
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BibTex
KOPYALA
@article{2013, title={FSI Study of the Effect of Air Inlet/Outlet Arrangements on the Reliability and Cooling Performances of Flexible Printed Circuit Board Electronics}, volume={33}, number={43–53}, publisher={Isı Bilimi ve Tekniği Dergisi}, author={W.C. LEONG, M.Z. ABDULLAH, C.Y. KHOR, H.J. TONY TAN}, year={2013} }
APA
KOPYALA
W.C. LEONG, M.Z. ABDULLAH, C.Y. KHOR, H.J. TONY TAN. (2013). FSI Study of the Effect of Air Inlet/Outlet Arrangements on the Reliability and Cooling Performances of Flexible Printed Circuit Board Electronics (Vol. 33). Vol. 33. Isı Bilimi ve Tekniği Dergisi.
MLA
KOPYALA
W.C. LEONG, M.Z. ABDULLAH, C.Y. KHOR, H.J. TONY TAN. FSI Study of the Effect of Air Inlet/Outlet Arrangements on the Reliability and Cooling Performances of Flexible Printed Circuit Board Electronics. no. 43–53, Isı Bilimi ve Tekniği Dergisi, 2013.